Superior ESI IP Technology Fuels Rapid Adoption of Model 2100 TFOS Laser Trimming System

PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class photonic and laser systems for micro-engineering applications, today announced it has received a multiple-system order from a leading North American analog integrated circuit (IC) manufacturer for its Model 2100 thin-film-on-silicon (TFOS) laser-trimming system. ESI’s patented 1.3 micron laser solution provides a robust process window with significantly higher yield and low cost-of-ownership (CoO) advantages over competitive systems. The 2100 TFOS systems will be used to expand production capacity at this customer’s North American facility.

ESI's Model 2100 was designed in cooperation with industry-leading prober manufacturers to provide a revolutionary approach to thin-film trimming. As a result, it allows customers to integrate their TFOS solution with the tester and prober of their choice to enable compelling technology, flexibility and cost benefits.

“Due to the increasing sophistication of consumer electronics, IC manufacturers require solutions that meet stringent technology parameters and deliver low-cost efficiencies to remain competitive,” noted ESI product marketing manager, Richa Anand. “While this multi-system order further expands ESI’s presence in the marketplace, it is the company’s leading proprietary technology that is quickly driving the 2100 system to become the 'tool of choice' in the industry. We value our strong partnership with this customer and remain committed to developing and leveraging our proprietary technologies to enable all our global customers with competitive advantages in a cost-effective solution.”

Features

The 2100 TFOS laser trimming system offers both a robust kinematic mount design for mating the trim head to the prober — providing superior accuracy and vibration resistance — and a standalone prober operation option on the trim head to provide maximum flexibility for manufacturers wrestling with changes in their production mix. The Model 2100 is available with ESI's patented 1.3-micron laser-trimming process or with the 1.0-micron laser option for customers with existing processes designed around that wavelength. The 1.3-micron wavelength enables significant improvements to the process window to greatly reduce the optoelectrical effects that plague standard laser-trimming processes. As a result, ESI's Model 2100 delivers significant throughput advantages over competing solutions, providing IC manufacturers with greater accuracy and increased yields and throughput in a single, low-cost solution.

About ESI, Inc.

ESI is a pioneer and leading supplier of world-class photonics and laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors — semiconductors, components and electronic interconnect — by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com.

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